The LED package acts as a casing that holds the chip, bond wire, and phosphor layer. The chips get separated and packaged into individual LED packages. The semiconductor wafers are then layered up and diced into small segments called chips. Next, the crystal ingot is sliced into semiconductor wafers, each sanded and cleaned to remove any dust, dirt, or organic material. After the rod is removed, the solution quickly cools and begins to crystalise to create a long crystal ingot. Once combined, a rod is placed into the solution and slowly pulled out. First, the semiconductor material is grown in a high-pressure, high-temperature chamber, where elements (gallium, arsenic, phosphor) are purified, mixed, and liquified into a concentrated solution. The process begins with the manufacturing of the LED chip. Each step must be executed to the highest standard to ensure quality control and product consistency. The LED lights manufacturing process is a complex procedure made up of three main steps: LED chips, LED package, and LED lamp.
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